96.5% Tin / 3.5% Silver & 96% Tin / 4% Silver
DESCRIPTION
Tin/Silver Alloys are compatible with most major electronic grade fluxes on the market today, and are available in paste and wire form in no-clean, water soluble and rosin chemistries.
FEATURES
- Excellent resistance
- Excellent solder joint reliability
- High Purity
- Compatible with most flux types
- Mfg. to J-Std-006
TEMPERATURE REQUIREMENTS
|
APPLICATION |
RECOMMENDED TEMPERATURE |
|
REFLOW SOLDERING |
PEAK TEMPERATURE 240 – 250 C (464 – 482 F) |
|
WAVE SOLDERING |
POT TEMPERATURE OF 260 C (500 F) |
|
HAND SOLDERING |
TIP TEMPERATURE OF 355 – 410C (700 – 800F) |
