Our lead free alloys are available in bar, preforms, wire, and spheres. BOW’s manufacturing process frees the alloy of impurities for lower surface tension and stronger solder joints.
BOW® Electronic Lead Free products meet or exceed the requirements of IPC/J-STD-006C.
SAC 305
SAC Alloys are the leading alloys replacing tin-lead solders for electronic assembly applications.
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BLF227®
BOW® Electronic Solders has developed BLF 227®, a low-cost lead free alloy available in core, solid and bar.
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96/4
Tin/Silver Alloys are compatible with most major electronic grade fluxes on the market today.
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CN100C
CN100C is our newest, low cost, silver-free alloy with a Germanium additive. It is a drop in replacement for SN100C.
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60/40
60/40 is a tin-lead solder suitable for use in many electrical and non-electrical commercial soldering applications.
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63/37
63/37 has a eutectic melting/solidification point and is one of the easiest solders to work with.
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