BLF 227® LEAD-FREE ALLOY
DESCRIPTION
BOW® Electronic Solders has developed BLF 227®, a low-cost Lead Free bar solder. BLF 227® is a near eutectic Tin/Copper/Nickel alloy. This alloy is proven to perform well in surface mount, wave soldering, and hand soldering applications. BLF 227 alloy may be used with existing equipment, processes, coatings, and flux chemistries. BLF 227® alloy is available in bar, cored wire, solid wire, foil, and preforms. BOW BLF 227® compares favorably to other low-cost, lead-free alloys of tin and copper in wetting and flow characteristics. BLF 227® is manufactured to J-STD-006 or better.
FEATURES
- Low cost, lead-free alloy
- Smooth solder joints with no visible shrinkage effects
- Excellent through-hole penetration and topside fillet
- Low dissolution of copper from boards and components into solder pot
- Near Eutectic alloy melting point of 227°C
- ROHS Complaint
FLUX COMPATIBILITY
BLF 227® alloy is compatible with many major electronic grade fluxes on the market today, and is available in wire form in no-clean and rosin chemistries.
TEMPERATURE REQUIREMENTS
|
APPLICATION |
RECOMMENDED TEMPERATURE |
|
REFLOW SOLDERING |
PEAK TEMPERATURE 210°-235°C (410°-455° F) |
|
WAVE SOLDERING |
POT TEMPERATURE OF 265°-280°C (520°-536°F) |
|
HAND SOLDERING |
TIP TEMPERATURE OF 370°-425°C (700°-800°) |
